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Event suggests brand owners can discover latest technologies
Global brand owners can discover the latest packaging technologies to enhance brand preference, reduce total systems costs, increase supply chain efficiencies and improve sustainability scores by attending PACK EXPO International, November 9–13, 2008 at McCormick Place in Chicago, IL.
With more than 90 percent of exhibit space already sold, PACK EXPO International will highlight innovation across all aspects of packaging, including equipment, components, materials and containers. When the show opens in November, attendees can expect to have access to more than 2,000 exhibitors occupying over 1.1 million net square feet of space.
“With its size and scope comes breadth and depth. PACK EXPO International is a unique opportunity for buying teams to achieve national and global packaging objectives for 2008 and beyond,” says Charles D. Yuska, president and CEO of PMMI, the sponsor and producer of PACK EXPO. “Companies can cost-effectively discover a wide range of machinery and materials to refresh existing brands, introduce new products, streamline operations and reduce carbon footprints — all in a single location.”
